{"best_oa_location":{"endpoint_id":null,"evidence":"deprecated","host_type":"publisher","is_best":true,"license":"cc-by","oa_date":"2024-09-09","pmh_id":null,"repository_institution":null,"updated":"deprecated","url":"https://doi.org/10.1080/17452759.2024.2399787","url_for_landing_page":"https://doi.org/10.1080/17452759.2024.2399787","url_for_pdf":null,"version":"publishedVersion"},"data_standard":2,"doi":"10.1080/17452759.2024.2399787","doi_url":"https://doi.org/10.1080/17452759.2024.2399787","first_oa_location":{"endpoint_id":null,"evidence":"deprecated","host_type":"publisher","is_best":true,"license":"cc-by","oa_date":"2024-09-09","pmh_id":null,"repository_institution":null,"updated":"deprecated","url":"https://doi.org/10.1080/17452759.2024.2399787","url_for_landing_page":"https://doi.org/10.1080/17452759.2024.2399787","url_for_pdf":null,"version":"publishedVersion"},"genre":"journal-article","has_repository_copy":true,"is_oa":true,"is_paratext":false,"journal_is_in_doaj":true,"journal_is_oa":true,"journal_issn_l":"1745-2759","journal_issns":"1745-2759,1745-2767","journal_name":"Virtual and Physical Prototyping","oa_locations":[{"endpoint_id":null,"evidence":"deprecated","host_type":"publisher","is_best":true,"license":"cc-by","oa_date":"2024-09-09","pmh_id":null,"repository_institution":null,"updated":"deprecated","url":"https://doi.org/10.1080/17452759.2024.2399787","url_for_landing_page":"https://doi.org/10.1080/17452759.2024.2399787","url_for_pdf":null,"version":"publishedVersion"},{"endpoint_id":"302d9ce38a5f34c594d","evidence":"deprecated","host_type":"repository","is_best":false,"license":"cc-by","oa_date":"2024-09-09","pmh_id":"oai:ira.lib.polyu.edu.hk:10397/111911","repository_institution":"Hong Kong Polytechnic University","updated":"deprecated","url":"http://hdl.handle.net/10397/111911","url_for_landing_page":"http://hdl.handle.net/10397/111911","url_for_pdf":null,"version":"acceptedVersion"},{"endpoint_id":"jbmd6t94fuxbshymjjbq","evidence":"deprecated","host_type":"repository","is_best":false,"license":"cc-by","oa_date":"2024-09-09","pmh_id":"oai:dr.ntu.edu.sg:10356/180612","repository_institution":"Nanyang Technological University","updated":"deprecated","url":"https://hdl.handle.net/10356/180612","url_for_landing_page":"https://hdl.handle.net/10356/180612","url_for_pdf":null,"version":"submittedVersion"}],"oa_locations_embargoed":[],"oa_status":"gold","published_date":"2024-09-09","publisher":"Informa UK Limited","title":"3D Cementitious composites printing with pretreated recycled crumb rubber: mechanical and acoustic insulation properties","updated":"2026-05-06T13:23:02Z","year":2024,"z_authors":[{"author_position":"first","is_corresponding":false,"raw_affiliation_strings":["Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_author_name":"Xiangyu Wang"},{"author_position":"middle","is_corresponding":false,"raw_affiliation_strings":["Department of Building Environment and Energy Engineering, The Hong Kong Polytechnic University, Hong Kong, People\u2019s Republic of China"],"raw_author_name":"Liangfen Du"},{"author_position":"middle","is_corresponding":false,"raw_affiliation_strings":["China Aerospace Times Feihong Technology Corperation Limited, Beijing, People\u2019s Republic of China","Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_author_name":"Zhenbang Liu"},{"author_position":"middle","is_corresponding":true,"raw_affiliation_strings":["Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_author_name":"Mingyang Li"},{"author_position":"middle","is_corresponding":false,"raw_affiliation_strings":["Department of Building and Real Estate, The Hong Kong Polytechnic University, Hong Kong, People\u2019s Republic of China"],"raw_author_name":"Yiwei Weng"},{"author_position":"middle","is_corresponding":false,"raw_affiliation_strings":["China Aerospace Times Feihong Technology Corperation Limited, Beijing, People\u2019s Republic of China","Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_author_name":"Zhixin Liu"},{"author_position":"middle","is_corresponding":false,"raw_affiliation_strings":["Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_author_name":"Yi Wei Daniel Tay"},{"author_position":"middle","is_corresponding":false,"raw_affiliation_strings":["School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_author_name":"Zheng Fan"},{"author_position":"middle","is_corresponding":false,"raw_affiliation_strings":["Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_author_name":"Teck Neng Wong"},{"author_position":"last","is_corresponding":false,"raw_affiliation_strings":["Singapore Centre for 3D Printing, School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_author_name":"Ming Jen Tan"}]}